Thermal Grease Paste TG-N8000 30ml for CPU Heat Transfers etc

Description

Specification:
Thermal Conductivity: 8.0 W/mK
Viscosity:330~530±100 Pa·s
Density: 3±1.5 g/cm³
Working Temperature: -40~125°C
Volume Resistance: 1x10^10
*Syringe should be used with glue gun
Application:
Electronic Components - 5G, Aerospace, AI, AIoT, AR/VR/MR/XR, Automotive, Consumer Devices, Datacom, Electric Vehicle, Electronic Products, Energy Storage, Industrial, Lighting Equipment, Medical, Military, Netcom, Panel, Power Electronics, Robot, Servers, Smart Home, Telecom, etc.
Features:
•Silicone free thermal gel
•Lower contact thermal impedance than thermal pads
•Physical property in between liquid and solid state
•Gap fillers for uneven or irregular surfaces of heat
sources and heat sink
•Applicable for dispenser
Storage:
Store in a cool, dry place away from direct sunlight.